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High Precision Selective Wave Soldering System Minimize Defects for SMT & Through-Hole PCBs

1 zestaw
MOQ
USD 19500-23000 Per Set
Cena £
High Precision Selective Wave Soldering System Minimize Defects for SMT & Through-Hole PCBs
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cechy
specyfikacje
Wymiar: 850L*1100W*1400H (mm)
Maksymalny rozmiar nośnika: Max: 330 (l)*250 (w) (mm)
Zakres ustawienia cesarstwa: MAX400 ℃
Dokładność pozycji: +/- 0,05 mm
Pojemność tygla lutowniczego: 15 kg/szt
Metoda podgrzewania: Górne ogrzewanie IR
Podkreślić:

high precision wave soldering system

,

selective wave soldering for SMT PCBs

,

through-hole PCB wave soldering machine
Podstawowe informacje
Miejsce pochodzenia: Chiny
Nazwa handlowa: Honeal
Numer modelu: OS-250C
Zapłata
Szczegóły pakowania: Eksportuj opakowania z drewna
Czas dostawy: 30 dni roboczych
Zasady płatności: T/T, Western Union, Moneygr
Możliwość Supply: 1000 zestawów/rok
opis produktu
High Precision Selective Wave Soldering System Minimize Defects for SMT & Through-Hole PCBs
Product Attributes
Dimension 850L*1100W*1400H (mm)
Max carrier size Max:330(L)*250(W)(mm)
Temperature setting range Max400 ℃
Position accuracy + / - 0.05 mm
Solder pot capacity 15 kgs /PCS
Preheat method Upper IR heating
Mini Wave Selective Soldering Machine for Electronics Production
Features
  • The machine integrates flux spraying and soldering
  • The solder pot is fixed, and the PCB board moves to realize soldering
  • Maximum PCB dimensions: 330 x 250mm
  • Small in occupation space and low in energy consumption
  • Manual placement and removal of boards
  • It is particularly suitable for the products of NPI
Technical Parameters
General Specifications
Model OS-250C
Overall Dimensions 850L*1100W*1400H (mm)
Machine frame and cover Tube frame + Door with painting
Operating height 900+30mm
Weight Approx.240KG
Power supply 1φ 220V 50/60HZ
Total power 5.5KW
PCB Parameters
PCB size Min:60(L)*40(W); Max:330(L)*250(W)(mm)
Top component height Max130mm
Bottom component height Max30mm
PCB Weight Max 5Kg
PCB Process Edge >3mm
Selective Spray System
Spray movement mode PCB movement in XYZ axis
Spray flux volume 2L
Spray flux add mode Manual
Spray nozzle type Needle
Spray cycle time 1 Sec/soldered dot (The minimum spray time can be set to 0.2 seconds)
Spray movement precision 0.05mm
Spray flow control pressure gage + flow valve
Selective Soldering System
Welding movement mode PCB movement in XYZ axis
Movement mode Step motor + linear rail
Solder feeding mode Manual (Option: auto)
Solder capacity 16KG
Solder melting time 30min
Solder power 3.3KW
Solder nozzle size Standard D8mm, other sizes is option
Solder cycle time 2~6 Sec/ soldered dot
Temperature control mode PID+SSR
Temperature setting range Max400 ℃
Temperature accuracy ±2 ℃
Waver height Max 5mm
Welding precision 0.1mm
Solder dross 0.2Kg/8H(N2 protection)
N2 Protection System
N2 protection mode Nozzle and solder pot
N2 consumption 1.5M3/h(Nitrogen concentration>99.999%)
N2 flow control Digital flow control
Exhaust System
Top cover exhaust Customer supply
Exhaust quantity 1 PCS
Exhaust volume About 5m³/min
Control System
Control mode PC+ motion control card
PCB Process parameter Setting, save, open in the PC screen
Other PCB counting, message, alarm can be read in the PC
Welding real-time monitoring
Options
Top safe cover
Safety light curtain
Top heater system
Barcode scanner
Easy-damaged parts
Spray flux nozzle, Soldering nozzle
Product Images
High Precision Selective Wave Soldering System Minimize Defects for SMT & Through-Hole PCBs 0 High Precision Selective Wave Soldering System Minimize Defects for SMT & Through-Hole PCBs 1
Etykietka:

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Skontaktuj się z nami
Osoba kontaktowa : Miss. Monica Wang
Tel : +8613715227009
Faks : 86-0755-23306782
Pozostało znaków(20/3000)
Bądź w kontakcie
Monica@szhonreal.com
+8613715227009
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