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Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering

Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering

MOQ: 1 zestaw
Cena £: USD 23800-26800 Per Set
standard packaging: Eksportuj opakowania z drewna
Delivery period: 30 dni roboczych
payment method: T/T, Western Union, Moneygr
Supply Capacity: 1000 zestawów/rok
Informacje szczegółowe
Miejsce pochodzenia
Chiny
Nazwa handlowa
Honeal
Numer modelu
OS-300
Wymiar:
L870 mm x w1230mm x h1550 mm
Maksymalny rozmiar nośnika:
Max: 350 (l)*300 (w) (mm)
Zakres ustawienia cesarstwa:
MAX400 ℃
Dokładność pozycji:
+/- 0,05 mm
Pojemność tygla lutowniczego:
13 kg /komputery
Metoda podgrzewania:
Górne ogrzewanie IR
Podkreślić:

mini desktop selective soldering machine

,

high precision automated soldering machine

,

PCB assembly wave soldering machine

Product Description
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering
Product Attributes
Attribute Value
Dimension L870mm X W1230mm X H1550mm
Max carrier size Max:350(L)*300(W)(mm)
Temperature setting range Max400 ℃
Position accuracy + / - 0.05 mm
Solder pot capacity 13 kgs /PCS
Preheat method Upper IR heating
Mini Wave Selective Soldering Machine for Electronics Production
Features:
  • The machine integrates flux spraying and soldering
  • The solder pot is fixed, and the PCB board moves to realize soldering
  • Maximum PCB dimensions: 300 x 300mm
  • Small in occupation space and low in energy consumption
  • Manual placement and removal of boards
  • It is particularly suitable for the products of NPI
Technical Parameters
Machine Parameters
Dimensions L870mm X W1230mm X H1550mm
Power supply Single phase 220V 50HZ
Shipping Parameters
Rail adjustable range 50-300MM
PCB board size L350 X W300MM
Transport height 900±30mm
Sports platform Pulley + slide rail
Movement accuracy ±0.25 mm
Tin Furnace Parameters
Crest drive Mechanical pump
Number of tin furnaces Single cylinder
Tin furnace capacity 13 kg / furnace
Nitrogen consumption About 1.5 ~2 m3/h per tin cylinder
Programmatically Manually enter coordinates
Product Details
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 0 Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 1
Certification
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 2
Packing
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 3
produkty
products details
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering
MOQ: 1 zestaw
Cena £: USD 23800-26800 Per Set
standard packaging: Eksportuj opakowania z drewna
Delivery period: 30 dni roboczych
payment method: T/T, Western Union, Moneygr
Supply Capacity: 1000 zestawów/rok
Informacje szczegółowe
Miejsce pochodzenia
Chiny
Nazwa handlowa
Honeal
Numer modelu
OS-300
Wymiar:
L870 mm x w1230mm x h1550 mm
Maksymalny rozmiar nośnika:
Max: 350 (l)*300 (w) (mm)
Zakres ustawienia cesarstwa:
MAX400 ℃
Dokładność pozycji:
+/- 0,05 mm
Pojemność tygla lutowniczego:
13 kg /komputery
Metoda podgrzewania:
Górne ogrzewanie IR
Minimalne zamówienie:
1 zestaw
Cena:
USD 23800-26800 Per Set
Szczegóły pakowania:
Eksportuj opakowania z drewna
Czas dostawy:
30 dni roboczych
Zasady płatności:
T/T, Western Union, Moneygr
Możliwość Supply:
1000 zestawów/rok
Podkreślić

mini desktop selective soldering machine

,

high precision automated soldering machine

,

PCB assembly wave soldering machine

Product Description
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering
Product Attributes
Attribute Value
Dimension L870mm X W1230mm X H1550mm
Max carrier size Max:350(L)*300(W)(mm)
Temperature setting range Max400 ℃
Position accuracy + / - 0.05 mm
Solder pot capacity 13 kgs /PCS
Preheat method Upper IR heating
Mini Wave Selective Soldering Machine for Electronics Production
Features:
  • The machine integrates flux spraying and soldering
  • The solder pot is fixed, and the PCB board moves to realize soldering
  • Maximum PCB dimensions: 300 x 300mm
  • Small in occupation space and low in energy consumption
  • Manual placement and removal of boards
  • It is particularly suitable for the products of NPI
Technical Parameters
Machine Parameters
Dimensions L870mm X W1230mm X H1550mm
Power supply Single phase 220V 50HZ
Shipping Parameters
Rail adjustable range 50-300MM
PCB board size L350 X W300MM
Transport height 900±30mm
Sports platform Pulley + slide rail
Movement accuracy ±0.25 mm
Tin Furnace Parameters
Crest drive Mechanical pump
Number of tin furnaces Single cylinder
Tin furnace capacity 13 kg / furnace
Nitrogen consumption About 1.5 ~2 m3/h per tin cylinder
Programmatically Manually enter coordinates
Product Details
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 0 Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 1
Certification
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 2
Packing
Mini Desktop Wave Selective Soldering Machine High Precision Automated Selective Soldering PCB Assembly Soldering 3